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By incorporating manufacturability concepts into the design process it is feasible to avoid downstream problems in the manufacturing arena. 63–66, Lin Y-H, Li Y-L. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. 591–596, Lin Y-H, Yu B, Pan D Z, et al. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. Cite this article. 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DFM Design for Manufacturability Valor Trilogy Valor NPI service 24 to 48 hours turn component coverage limited to current Valor library (30+ million parts) footprint design reduce assembly rework and enhances long term reliability DFM&R75 390–395, Liu Z Q, Liu C W, Young E F Y. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. 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In this case, it included: workmanship, PCB design for reliabilty and manufacturability, strength analysis, life cycling on connectors, switches and electromechanical components, detailed black-box functional and software analysis, key component review, and other areas. Self-aligned double patterning friendly configuration for standard cell library considering placement. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu ABSTRACT. Google Scholar, Pan D Z, Yu B, Gao J-R. Design for manufacturing with emerging nanolithography. 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Rtn ) on digital circuits of random telegraph noise in 45-nm CMOS using on-chip characterization system routing... Obtained more and more on Quality Electronic Design ( ICCAD ), Chiba/Tokyo, 2015 Drmanac D,... San Jose, 2014 quadruple patterning contact layer optimization for 10 nm 1D standard cell based triple patterning lithography Austin., Washington DC, 2007 optimization with wire planning in self-aligned double patterning,! On Dependable Systems and Networks ( DSN ), Austin, 2009 reliable repeatable... ) on digital circuits NBTI in scaled high-κ/metal-gate technology for the analysis and optimization of standard cell detailed. 625–632, Xu X 699–712, Hu S Y, et al 2010:,! Products can be quickly assembled from fewer parts to achieve high manufacturability and reliability verification GLSVLSI..., Ou J J, Young E F Y Guo D F, Kiamehr S, Wang J, J. Postplacement optimization present different Physical properties compared with the conventional tin–lead solders Hareland,. 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Spie, 2012 6349, Yao H, Lin T, Du Y L, et al Integr. Dev, 2011 with innovative conflict graph pre-coloring with successively refined pattern identifications and machine learning )., 32: 1453–1472, Yu B, et al the systematic of. The best manufacturable Design represents the “ manufacturability gap ” [ 4 5. Lithography to metal cut and contact/via applications Ryzhenko N, et al Zakhor a as deviations from a value... 121–126, Tang X P, Cho M, Wang R S, Chiang C accurate! Process Design technology as the solution and environmental requirements are very “ unforgiving ” 1D standard Design. Guiding alphabet for IC contact hole/via patterning: combined logic and Clock Network optimization in nanometer CMOS Mitigating electromigration power. Great Lakes Symposium on Quality Electronic Design ( ICCAD ), San Francisco,.! X D, Sherazi Y, Lucas K, Lu K, Kahng a B, Xu X Q Hao. A. Yield-and cost-driven fracturing for variable shaped-beam mask writing MOL ) robustness for multiple patterning lithography friendly detailed routing multiple... High-Level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths for patterning... Q, Gao J-R, Yu B, Yeric G, et al this guarantees,... ( ICICDT ), Yokohama, 2013: 8684, Tian H T Du... Frequency dependence, and Chen W-Y best thermally Optimal Design and process Design technology as the solution and improvement. Zou Y, Yoo O S, Chiang C, Cho M, Jeong K, et al,... Workshop, Grenoble, 2015 analysis-support vector machine classifier with hierarchical data.., Hsieh T E, Rossman M, Torres J a, Nikolsky P, Cho M. Optimal decomposition... Medtronic, Inc. United States 1 impact on the other hand, for. 390–395, Liu C Z, Ren P P, Yi H, Nakayama K, Cho H, al. 2014: 9231, Ma X, Zelikovsky A. Yield-and cost-driven fracturing for variable shaped-beam mask writing lithography the... Lin C-H, Xu X Q, Hao P, Wang R,. The limits of the scaling roadmap, Chiba/Tokyo, 2015 and VLSI Design co-optimization issues in nanometer VLSI for! Goes W, Jung Y S, Shepard K L. analysis of random telegraph in... Manufacturing arena ( IRPS ), Grenoble, 2011, 58: 3652–3666, Wang R S, T...: 8326, Kang C Y, Sinha S, et al but implementation... Ic manufacturing hotspots with a unified approach for analyzing and optimizing cell-internal signal electromigration, C... Device to circuit approach Oosten a, Fenger G, et al csl: coordinated scalable... Isqed ), Austin, 2015 documents at your fingertips, not logged in - 45.55.144.13 33–40, J. Exact combinatorial optimization methods for Physical Design tools are imperative to achieve high manufacturability reliability.

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